M.S. Theses (Professional Master Program)
- 葉同學(1999/9-2001/6), 方針管理之應用與效益探討--以裕隆汽車公司為例 (Hoshin Management: A Case Study)
- 彭同學(1999/9-2001/7), 田口方法於馬口鐵蓋切線生銹改善之應用 (The Application of Taguchi Method to Improve the Score Line Corrosion for Full Aperture Tinplate Easy-Open-Ends)
- 吳同學(1999/9-2001/7), TL 9000之實施與個案研究 (The TL 9000 implementation and case study)
- 張同學(1999/9-2002/1), 田口方法於半導體封裝製程改善之應用--以焊線站之焊線強度最佳化為例 (Application of Taguchi Methods to Improve the Semiconductor Packaging Process—A Case Study for Wire Strength Optimization of Wire Bonding Process)
- 邱同學(1999/9-2002/7), 田口方法於矽晶圓廠長晶製程改善之運用 (Improvement of Crystal Pulling Process in Wafer Fabrication by the Taguchi Methods)
- 李同學(1999/9-2002/7), 田口方法於球閘陣列載板製程改善之應用 (Application of Taguchi Methods to Improve the Ball Grid Array Substrate Process)
- 喬同學(2001/9-2003/6), 應用六標準差方法提升半導體封裝製程品質 (Improve IC Assembly Process Quality through the Six Sigma Approach)
- 游同學(2001/9-2003/6), MTS在測試流程改善的應用—以筆記型電腦為例 (Improvement of the Note Book Computer Testing Process Using MTS)
- 葉同學(2001/9-2003/6), 六標準差行銷--以半導體封測產業為例 (Marketing for Six Sigma--The Case of Semiconductor Package/Test)
- 徐同學(2001/9-2003/6), 應用田口方法於液晶顯示器應答速度之研究 (Application of Taguchi Methods to Improve the Response Time of LCD)
- 陳同學(1999/9-2004/4), 應用類神經網路於晶粒表面銲墊變色辨識之研究 (Using Neural Networks for Die Pad Discoloration Detection)
- 林同學(2002/9-2004/8), 應用田口方法於數位影像掃描器齒輪傳動的異音及影像對位問題之研究 (Apply Taguchi Methods to the Digital Scanner Transmitting Noises and Imaging Position Problems)
- 余同學(2002/9-2005/10), 六標準差設計應用於ODM電子產品設計品質提升之研究 (DFSS in ODM Electronic Product Development—A Case Study of Wireless Communication Product
- 胡同學(2001/9-2005/12), 運用田口方法改善無線網路卡功率測試機台誤判之研究 (Application of Taguchi Methods to Reduce Misjudgement of Wireless Network Card Power Test Equipment)
- 吳同學(2000/9-2007/1), 應用類神經網路於自動櫃員機提款預測之研究 (The Forecasting of Cash Withdrawals from ATM by Using Artificial Neural Network)
- 孔同學(2001/9-2007/10), 應用類神經網路減少TFT-LCD產品測試項目之研究 (Reducing Test Items of TFT-LCD Product By Using Neural Networks)
- 林同學(2001/9-2008/7), 應用田口方法改善接觸式三次元測量儀量測品質 (Application of Taguchi Methods to Improve the Performance of Coordinate Measuring Machine)
- 羅同學(2001/9-2008/7), 應用精實六標準差改善存貨管理績效 (Improve Performance of Inventory Management through Lean Six Sigma)
- 謝同學(2005/9-2008/12), 應用倒傳遞類神經網路於無線產品效能預估之研究 (Forecasting Transmission Efficiency of WLAN Product by Using Back-Propagation Neural Networks)
- 葉同學(2005/9-2008/12), 田口方法於製程參數最佳化之應用--以發光二極體產品為例 (Process Optimization by Taguchi Methods: A Case Study of Light Emitting Diode Manufacturing Process)
- 陳同學(2006/9-2008/12), 應用田口方法達成拋光製程參數最佳化 (Application of Taguchi Methods to Optimize the Parameter of Polishing Process)
- 黃同學(2005/9-2009/4), 非自然型態之管制圖關鍵影響因素研究—以低溫多晶矽薄膜電晶體液晶顯示器之微影製程為例 (Research on Critical Factors of Unnatural Control Chart Patterns--A Case Study of Lithography Process in LTPS TFT LCD)
- 林同學(2006/9-2009/7), 利用六標準差手法提升封裝廠之晶片切割良率 (Improve Wafer Sort Yield in Assembly House Through Six Sigma)
- 劉同學(2007/9-2009/7), 應用六標準差於中小型尺寸TFT LCD面板強度改善 (Applying Six Sigma Methodology to Improve Bending Strength of Small and Medium Sized TFT LCD)
- 楊同學(2005/9-2009/11), 外包架構之研究—以半導體廠設備預防保養為例 (Outsourcing Management Research: A Case Study of IC Equipment Preventive Maintenance)
- 張同學(2006/9-2009/11), 運用六標準差方法改善馬達異音問題 (Motor Noise Problem Improvement by Six Sigma Approach)
- 薛同學(2003/9-2010/6), 田口方法於切削中心加工機製程參數最佳化之應用—以石英玻璃表面加工為例 (Machining Center Process Optimization by Taguchi Methods: A case Study of Quartz Glass Surface Manufacturing Process)
- 鄧同學(2008/9-2010/6), 六標準差的專案選擇--以PCB產業為例 (Six Sigma Project Selection for PCB industry)
- 林同學(2009/9-2010/6), 應用田口方法最佳化可撓式顯示器之光學白度特性 (Optimization of the Optical Whiteness Ratio for Flexible Display by Using Taguchi methods)
- 許同學(2006/9-2011/4), 應用狩野模式分析背光模組之品質要素 (Application of the Kano Model for Analyzing the Quality Attributes of Backlight Unit of TFT-LCD)
- 張同學(2007/9-2011/4), 用六標準差方法改善焊線式電源連接器斷電問題 (Improving Malfunction of Wired Power Jack Connector Through Six Sigma)
- 吳同學(2004/9-2011/7), 運用六標準差方法提升發光二極體後段製程良率 (Apply Six Sigma approach to improve the Backend process yield of LED)
- 林同學(2006/9-2011/12), 應用六標準差DMAIC手法提升連接器撥線製程良率 (Enhancing Yield Rate of Connector Manufacturing Process by Using Six Sigma DMAIC Methodology)
- 陳同學(2004/9-2011/12), 主題式稽核於ISO 9000品質管理系統之應用--個案研究 (The Application of Themed Surveillance in ISO 9000 Quality Management System--A Case Study)
- 許同學(2010/9-2012/4), 利用六標準差手法改善印刷電路板之內層開路問題 (Improve PCB Inner Layer Open Circuit Through Six Sigma)
- 張同學(2005/9-2012/5), 晶圓廠成本系統架構之研究 (The Study on the Cost Systems of Wafer Fabrication Plants)
- 陳同學(2010/9-2012/5), 新產品開發設計變更流程之發展與應用 (The Development and Application of Design Change Processes in New Product development)
- 鄧同學(2010/9-2012/5), 結合FMEA與田口方法於電子紙顯示器之可靠度特性改善 (Combining FMEA and Taguchi Methods to Improve the Reliability of electronic Paper Display)
- 蘇同學(2009/9-2012/7), 應用六標準差設計方法改善液晶電視色偏問題 (LCD-TV Color Shift Improvement by DFSS Approach)
- 朱同學(2011/9-2014/6), 應運用六標準差手法解決Nand Flash IC半導體脫層問題 (improve Delamination Problem of NanD Flash IC Package by Using Six Sigma Methodology)
- 薛同學(2012/9-2014/6), TFT-LCD光學膜片裁切製程外包決策分析 (An Analysis on Outsourcing Decision for the TFT-LCD Optical Films Cutting Process)
- 胡同學(2012/9-2014/7), 產品開發流程之改善—以智慧型手機製造為例 (Improvement of the Product Development Process—A Case of Smartphone Manufacturing)
- 蔣同學(2012/9-2014/12), 應用六標準差改善IC載板金手指凸起問題 (Using Six Sigma to improve IC carrier finger nodule problem)
- 簡同學(2012/9-2014/12), 電腦週邊設備業之單件流生產 (One-piece flow manufacturing for computer peripherals industry)
- 方同學(2011/9-2015/5), 應用六標準差設計DMADV手法改善WiFi產品重測率 (Using Design for Six Sigma DMADV Methodology to Improve Retest Rate of WiFi Product)
- 黃同學(2011/9-2015/5), 應用六標準差DMAIC方法論改善凸塊製程錫球推力 (Applying Six Sigma DMAIC to improve Ball Shear in Bumping Process)
- 王同學(2013/9-2015/5), 儲存系統新產品開發階段品質改善流程-個案研究 (A Case Study of New Product Development Process Enhancement for Storage System)
- 陳同學(2014/9-2015/6), 應用類神經網路決定重要IC測試程式組合之決定 (Application of IC Test Program Setup Using Neural Network)
- 簡同學(2014/9-2015/12), 提高六標準差認證合格率:個案研究 (Six Sigma Certification Rate Improvement: Case Study)
- 施同學(2013/9-2016/6), 運用倒傳遞類神經網路預測錫銀凸塊電鍍參數 (Predicting the Sn-Ag solder plating parameters by back propagation neural network)
- 呂同學(2014/9-2016/6), 應用SERVQUAL與IPA評量客戶稽核服務品質績效-以半導體封測廠為例 (Applying SERVQUAL and IPA to Evaluate Customer Audit Service Quality –A Case Study of Semiconductor Assembly House)
- 蘇同學(2014/9-2017/7), 運用QC Story改善後段網印品質-以太陽能電池產業N公司為例 (Application of QC Story to Improve the Cell Quality of Printing Process-A Case Study of N Company for the Solar Cell Industry)
- 黃同學(2015/9-2017/7), 應用精實六標準差方法改善晶圓出貨流程之產出量 (Throughput improvement in Wafer Outgoing flow by Lean Six Sigma)
- 王同學(2015/9-2017/7), 應用六標準差DMAIC於藍寶石雙拋片之抗壓強度改善:個案研究 (Improvement of the Compressive Strength of Sapphire Double-sided Polishing Wafer Using Six Sigma DMAIC: A Case Study)
- 賴同學(2015/9-2017/7), 應用8D手法改善IC基板短路問題 (Improvement of Integrated-Circuit Substrate Short Failure Issue using Ford Eight Disciplines Methodology)
- 洪同學(2015/9-2017/7), 魅力品質之創造:以矽薄膜太陽能產品為例 (Attractive Quality Creation: A Case Study for the Silicon Thin Film Photovoltaic)
- 王同學(2016/9-2017/9), P型矽多晶太陽能電池製程於電勢誘發衰減現象之改善 (Improvement of Potential Induced Degradation on Cell-Level in P-Type-Poly Si Solar Cell Process)
- 鍾同學(2015/9-2018/1), 應用六標準差提升TFT-LCD微影製程良率 (Yield Improvement of Photo Engraving Process in TFT-LCD Using Six Sigma Methodology)
- 劉同學(2016/9-2018/6), 應用多元迴歸與倒傳遞類神經網路預測企業獲利能力之研究 (Forecasting Business Profitability by Using Multiple Regression Analysis and Back-propagation Neural Network)
- 李同學(2016/9-2018/6), 運用專案管理手法建構MFMEA降低半導體製造廠設備異常發生率 (Implementation of MFMEA in Semiconductor Manufacturing Equipment: A Case Study)
- 楊同學(2016/9-2018/10), 應用六標準差改善鋰電磁模組熱失控 (The Improvement of Lithium Battery Module Thermal Runaway Using Six Sigma Methodology)
- 陳同學(2016/9-2018/10), 應用六標準差改善研磨墊溝渠表面粗糙度 (Improving the Surface Roughness of the Polishing Pad Groove Using Six Sigma)
- 黃同學(2017/9-2019/6), 應用精實六標準差改善動物實驗流程時間:個案研究 (Applying Lean Six Sigma to Improve Animal Experiment Process Cycle Time: A Case Study)
- 曾同學(2017/9-2019/12), 應用六標準差方法於半導體封裝製程改善:個案研究 (Applying Six Sigma in Semiconductor Packaging Process Improvement: Case Study)
- 張同學(2018/9-2019/12), 基於卷積神經網路之LED板材瑕疵分類 (Defect Classification of Light-emitting Diode Lead-frame Based on Convolutional Neural Networks)
- 張同學(2018/9-2019/12), 運用卷積神經網路於軟性印刷電路板瑕疵分類 (Defect Classification of Flexible PCB Based on Deep Convolutional Neural Networks)
- 蘇同學(2018/9-2020/6), 應用DMAIC程序與田口方法於熱塑性聚胺酯產品耐磨耗之改善 (Abrasion Improvement of Thermoplastic Polyurethane by Using DMAIC Procedure and Taguchi Methods)
- 邱同學(2018/9-2020/6), 應用田口方法提高SMT微型元件之銲錫性--以0201元件焊接改善為例 (Application of Taguchi Methods for Optimization of SMT Ultra Small Chip’s Solderability—A Case Study of Soldering Improvement for 0201 Chips)
- 陳同學(2018/9-2020/7), 新產品開發流程之設計與應用—以晶圓級封裝產業為例 (Design and Application of New Product Development Process—A Case Study of the Wafer Level Packaging Industry)
- 林同學(2018/9-2020/7), 運用類神經網路優化備料決策:個案研究 (A Neural Network Approach to Optimize Material Preparation Decisions: Case Study)
- 鍾同學(2019/9-2021/6), 應用精實六標準差方法提升品質異常處理流程之績效 (Applying the Lean Six Sigma Method to Improve the Performance of the Quality Deviation Handling Process)
- 卓同學(2019/9-2021/6), 應用精實六標準差改善半導體公司包裝流程 (Application of Lean Six Sigma in the Packing Process of a Semiconductor Company)
- 陳同學(2019/9-2021/6), 應用馬氏距離於客訴產品之判定--個案研究 (Applying Mahalanobis Distance in Judgement of Customer Complaint Product--A Case Study in an ICT Company)
- 徐同學(2019/9-2022/5), 應用田口法改善封裝點膠製程穩定性之研究- 以A封裝廠為例 (A Stability Optimization of Dispensing Process by the Taguchi Methods- A Case Study of Assembly Factory)
- 蘇同學(2020/9-2022/5), 應用資料探勘技術於半導體事故診斷之研究 (The Study of Applying Data Mining Techniques to the Fault Diagnosis of Semiconductor Manufacturing)
- 陳同學(2020/9-2022/5), 應用六標準差DMAIC手法改善熱固性樹脂裝飾板外觀缺陷 (Improve Appearance Defect on Thermosetting Resins Decorative Laminate by Using Six Sigma DMAIC Method)
- 林同學(2020/9-2022/5), 女性肺結節危險因子之分析與探討 (Analysis and Discussion of Risk Factors for Female Pulmonary Nodules)
- 陳同學(2020/9-2022/12), 探討影響尚未實施Tw-DRGs項目於醫療效率與品質之風險因素 (Exploring risk factors impacting on the efficiency and quality of healthcare in the unimplemented Tw-DRGs program)
- 林同學(2021/9-2022/12), 應用六標準差方法提升晶圓背面研磨製程能力 (Application of Six Sigma Methodology to Level up Wafer Backside Grinding Process Capability)
- 劉同學(2021/9-2023/7), 應用精實六標準差改善工廠組裝績效實證研究—以某載板設備製造業為例 (Application of Lean Six Sigma to Improve the Assembly Process Cycle Efficiency– A Case Study of a Machinery Equipment Company)
- 王同學(2021/9-2023/12), 使用AHP方法決定智慧型穿戴裝置電子票證之導入地區 (Using AHP Method to Determine the Region for Introducing Smart Wearable Device Smart Card)